Wafer Dicing | Wafer Grinding | UV Tape

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wafer-handling
1003R
Tape Dicing Grinding
ULTRON SYSTEMS
1003R Silicone-Free Blue Adhesive Plastic Film - 135-micron
135 Micron
High Tack
100 Meter Rolls
wafer-handling
1004R
Tape Dicing Grinding
ULTRON SYSTEMS
1004R Silicone-Free Blue Adhesive Plastic Film - 130-micron
130 Micron
Medium-High Tack
100 Meter Rolls
wafer-handling
1005R
Tape Dicing Grinding
ULTRON SYSTEMS
1005R Silicone-Free Blue Adhesive Plastic Film - 125-micron
125 Micron
Medium Tack
100 Meter Rolls
wafer-handling
1007R
Tape Dicing Grinding
ULTRON SYSTEMS
1007R Silicone-Free Blue Adhesive Plastic Film - Medium tack
80 Micron
Medium Tack
100 Meter Rolls
wafer-handling
1008R
Tape Dicing Grinding
ULTRON SYSTEMS
1008R Silicone-Free Blue Adhesive Plastic Film - Medium-high tack
80 Micron
Medium-High Tack
100 Meter Rolls
19 Sizes:
1008R Silicone-Free Blue Adhesive Plastic Film - Medium-high tack 10"1008R Silicone-Free Blue Adhesive Plastic Film - Medium-high tack 10,5"1008R Silicone-Free Blue Adhesive Plastic Film - Medium-high tack 11"More...
wafer-handling
1009R
Tape Dicing Grinding
ULTRON SYSTEMS
1009R Silicone-Free Blue Adhesive Plastic Film - Low tack
80 Micron
Low Tack
100 Meter Rolls
19 Sizes:
1009R Silicone-Free Blue Adhesive Plastic Film - Low tack 10"1009R Silicone-Free Blue Adhesive Plastic Film - Low tack 10.5"1009R Silicone-Free Blue Adhesive Plastic Film - Low tack 11"More...
wafer-handling
1020R
Tape UV
ULTRON SYSTEMS
1020R UV Curable Adhesive Film (PVC)
95 Micron
PVC Film
100 Meter Rolls
wafer-handling
1027R
Tape UV
ULTRON SYSTEMS
1027R UV Adhesive Film (Polyolefin)
175 Micron
Polyolefin Film
100 Meter Rolls
wafer-handling
1042R
Tape UV
ULTRON SYSTEMS
1042R Anti-Static UV Adhesive Film (Polyolefin)
98 Micron
Polyolefin Film
100 Meter Rolls
wafer-handling
1043R
Tape UV
ULTRON SYSTEMS
1043R Anti-Static UV Adhesive Film (Polyolefin)
168 Micron
Polyolefin Film
100 Meter Rolls
wafer-handling
Diamond Wire (LED)
Diamond Wire
SAESOL
Diamond Wire (LED)
A diamond tool used in the wire-sawing step as part of the semiconductor wafering process; The main function is for slicing sapphire and silicon ingot.
LED
230~250µm
Ingot Slicing
wafer-handling
Diamond Wire (Sunlight)
Diamond Wire
SAESOL
Diamond Wire (Sunlight)
A diamond tool used in the wire-sawing step as part of the semiconductor wafering process; The main function is for slicing sapphire and silicon ingot.
Sunlight
100~140µm
Ingot Slicing
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