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Wafer Dicing | Wafer Grinding | UV Tape
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wafer-handling
1003R
Tape Dicing Grinding
ULTRON SYSTEMS
135 Micron
High Tack
100 Meter Rolls
wafer-handling
1004R
Tape Dicing Grinding
ULTRON SYSTEMS
130 Micron
Medium-High Tack
100 Meter Rolls
wafer-handling
1005R
Tape Dicing Grinding
ULTRON SYSTEMS
125 Micron
Medium Tack
100 Meter Rolls
wafer-handling
1007R
Tape Dicing Grinding
ULTRON SYSTEMS
80 Micron
Medium Tack
100 Meter Rolls
wafer-handling
1008R
Tape Dicing Grinding
ULTRON SYSTEMS
80 Micron
Medium-High Tack
100 Meter Rolls
wafer-handling
1009R
Tape Dicing Grinding
ULTRON SYSTEMS
80 Micron
Low Tack
100 Meter Rolls
wafer-handling
1020R
Tape UV
ULTRON SYSTEMS
95 Micron
PVC Film
100 Meter Rolls
wafer-handling
1027R
Tape UV
ULTRON SYSTEMS
175 Micron
Polyolefin Film
100 Meter Rolls
wafer-handling
1042R
Tape UV
ULTRON SYSTEMS
98 Micron
Polyolefin Film
100 Meter Rolls
wafer-handling
1043R
Tape UV
ULTRON SYSTEMS
168 Micron
Polyolefin Film
100 Meter Rolls
wafer-handling
Diamond Wire (LED)
Diamond Wire
SAESOL
A diamond tool used in the wire-sawing step as part of the semiconductor wafering process; The main function is for slicing sapphire and silicon ingot.
LED
230~250µm
Ingot Slicing
wafer-handling
Diamond Wire (Sunlight)
Diamond Wire
SAESOL
A diamond tool used in the wire-sawing step as part of the semiconductor wafering process; The main function is for slicing sapphire and silicon ingot.
Sunlight
100~140µm
Ingot Slicing
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