A diamond tool used in the wire-sawing step as part of the semiconductor wafering process; The main function is for slicing sapphire and silicon ingot.
Standard:
- 100~140µm (Diamond-Nickel Bonding)
Application:
- Ingot Slicing
Features:
- Minimizing diamond clusters deposited on wires and optimizing the degree of uniformity
- High reuse rates compared to the competition
