SPIN150x Standard - Spin coater POLOS® - Integrator Model NPP

The POLOS® SPIN150x is a versatile spin processor designed for reliable and repeatable substrate processing in research, development and production environments. Its flexible configuration allows the system to be adapted to different process requirements, with Natural Polypropylene (NPP) and PTFE chamber options and Standard or Advanced configurations available.

The system accommodates wafers up to 150 mm (6") and square substrates up to 100 × 100 mm, making it suitable for a wide range of applications. From coating and developing to cleaning, etching and rinse-and-dry processes, the SPIN150x provides precise control across multiple process steps.

Key applications

• Coating
• Cleaning
• Rinse & dry
• Developing
• Etching
• PDMI and related processes

Flexible installation and configuration
The SPIN150x is designed to fit easily into different laboratory and production setups. Its housing and drainage configuration can be converted between tabletop and in-deck installation, while the modular platform supports a broad range of accessories and optional equipment.
Dispensing can be configured to suit the process, with a central injection point for a syringe or dispense nozzle. The Advanced model additionally features an automatic lid with optional foot-pedal operation.

Designed for automated handling
The SPIN150x can be integrated into automated substrate handling systems. Programmable motor homing positions support accurate robot alignment, while the raised vacuum chuck provides clear access for loading and unloading substrates with tweezers, vacuum tools or robotic grippers.

Safety and process control are supported by features including a lid lock, vacuum sensor and large detachable touchscreen interface. Recipes can be stored and transferred via the integrated USB port, which can also be used for software updates.

Protection against liquid ingress
An integrated liquid filter trap helps protect the drive and vacuum components from accidental liquid ingress. Positioned between the process chamber and vacuum system, the trap collects fluids before they can reach sensitive components such as the vacuum sensor, drive mechanics and ServoBL Controller.
The collection jar is visible through a side window and can be removed easily for inspection and maintenance.

Hardware specifications

Process chamber

• NPP or PTFE construction
• Supports wafers up to 150 mm (6") or substrates up to 100 × 100 mm
• Integrated liquid filter trap
• Automatic lid on Advanced model, with optional foot-pedal control
• Programmable motor homing
• Center injection point for syringe or dispense nozzle
• Lid lock and vacuum sensor
• Detachable touchscreen interface
• USB connection for recipe storage and software updates

Drive unit

• Brushless indirect drive
• Speeds up to 12,000 RPM
• Precision speed and acceleration control from 1–30,000 RPM
• CW, CCW and puddle rotation modes
• Convertible tabletop or in-deck configuration

Chuck & adapter

• Vacuum chuck for 4–6" wafers
• Fragment adapter for samples ≥10 mm