Applications
- Shipping/receiving area: Wafer transfers are used to move incoming wafers from a shipping cassette to a WIP production cassette.
- Epitaxial area: Wafer transfers are used to move incoming wafers from a shipping cassette to a WIP production or specialty EPI process cassette.
- Wet chemistry areas: Wafer transfers are used to move wafers between a WIP production cassette to a wet process Teflon PFA cassette when they enter wet chemistry areas.
- Thermal process bake areas: Wafer transfers are used to move wafers between a WIP production cassette and metal or quartz cassettes when they enter thermal process bake process areas
- Metrology and inspection areas: Wafer transfers may also occur in metrology and inspection areas where wafers are analyzed and inspected for defects and other quality control measures.
- Probe and test areas: Wafer transfers are used to move incoming wafers from a shipping cassette to a WIP production cassette.
- Odd-Even Split Lots: Specialty wafer transfers are used to split parent lots into odd (13) and even (12) groups. Splitting the parent lot into odd and even groups is a common practice in semiconductor manufacturing that helps to ensure quality, consistency, and efficiency in the production process.
- Wafer Flipping/Inverting: Wafer transfers are used to move wafers from one cassette to another that has been inverted 180°. In semiconductor manufacturing, there are various processes that involve working on the backside of a wafer. These processes can include backside lithography, etching, deposition, and bonding, among others. To carry out these processes, the manufacturer needs to flip the wafer over so that the backside is facing up.
Material: Stage: Anti-Static PEEK | Rods: Carbon Fiber
Type: Automatic System
Advanced technology automatic SafeGuard wafer transfer for 76 mm up to 200 mm wafers. Engineered for InP, GaAs, GaN and SiC compound wafer handling. Features motorized 25-set transfer arm assembly for gentle lifting of wafers – protecting the wafer edge from abrasion or shock to increase yields; touchscreen recipe software for standard operation and password protected service menu for motor, axis control, event logging. Thin and bonded wafer compatible. ISO 3 (FS209E Class 1) Cleanroom Compatible. SEMI Compliant High- and Low-Profile Cassettes
