RIE

The RIE process is a chemical physical etching process, and is the most important process for constructing various films in semiconductor manufacturing.

Applications

• Basic plasma research.
• III-V compound semiconductors (GaAsn, InP, GaN) etching.
• Si, SiO₂, SiN_x etching.
• MEMS.
• Metal, silicon, resist etching.

Configurations

• Flexible substrate size up to 12 inch in diameter.
• Single wafer or multi wafers.
• Excellent thin-film uniformity of less than ±5%.
• Mass flow controllers with highly uniform gas distribution up to 6 gas lines.
• Substrate chuck heating up to 400°C or cooling down to -20°C by stable process temperatures.

Chamber

• Aluminum hard anodized chamber.
• Chamber temperature control by using water chiller/heater.

Options

• Turbo-molecular pump package.
• Optical emission spectrometer for EDP (Endpoint detector).