POLOS

POLOS Beam

POLOS Beam
POLOS

POLOS Beam

Sub-micron resolution while exposing a write field in less than two seconds 
 Semi-automatic alignment for completed multilayer alignment within minutes
 Equipped with a 405 nm Engine and 20x objective
 Ultrafast Autofocus

Maskless lithography enables nanopatterning on demand, eliminating the need for costly and time-consuming photomasks. This flexibility makes it ideal for research and rapid prototyping.
BEAM takes these advantages by delivering maskless lithography in a true desktop form factor without compromise in performance.

At its core, the POLOS® Beam Engine projects submicron patterns directly onto the substrate. Precision steppers enable seamless stitching of multiple write fields, making it possible to expose substrates up to 6 inches in diameter.

Compact

Full-featured maskless lithography, smaller than a desktop computer.

Powerful

Sub-micron resolution while exposing a write field in less than two seconds.

Ultrafast Autofocus

Piezo-actuators reach focus in less than a second when combined with our close looped focus optics.

No-fuss Multilayer

Semi-automatic alignment allows multilayer alignment to be completed within minutes.

The included software makes quick work of any patterning job; just load, align and expose. Navigation is similar to CNC systems.