Modular eFOUP Front opening unified pod 8" (200mm) wafers - 25 slots

The ePAK Modular eFOUP is a configurable Front-Opening Unified Pod designed for the secure handling, storage, and transport of semiconductor wafers and film frames. Built to order, it accommodates both 200 mm and 300 mm wafer formats and supports a range of manufacturing requirements through six permanently installed insert options.

Depending on the selected insert, the eFOUP can hold 13 or 25 wafers in either 200 mm or 300 mm sizes, or up to 25 film frames measuring 276 mm. A dedicated molded insert is also available for the safe transport of probe cards, helping to minimize vibration and prevent mechanical damage during handling and shipment.

Designed for advanced semiconductor environments, the modular eFOUP provides reliable protection against contamination, electrostatic discharge (ESD), and physical impact. By maintaining a controlled and secure environment, it helps preserve wafer integrity and supports consistent manufacturing yields.

The front-opening design complies with SEMI and FIMS standards and integrates seamlessly with Automated Material Handling Systems (AMHS) and robotic process equipment. This enables efficient, automated wafer transfers while reducing operator interaction and the risk of contamination.