SYSKEY TECHNOLOGY Co., Ltd.
Metal Thermal
SYSKEY TECHNOLOGY Co., Ltd.
Metal Thermal
Flexible substrate size up to 12 inch wafer in diameter or 470 x 370 mm2 glass
Substrate holder heating up to 800°C
Excellent thin-film uniformity of less than ±3%.
The evaporation source using electric heating can be used to deposit most organic and inorganic thin films, among which the resistance Joule method is the most common.
Applications
- Metal materials research.
- Nano film.
- Solar-cell.
Configurations
- Flexible substrate size up to 12 inch wafer in diameter or 470 x 370 mm2 glass.
- Full-width opening door (HV chamber) integrated two viewports with shutters for observing substrate and evaporation sources.
- Excellent thin-film uniformity of less than ±3%.
- Multiple sources with sequential operation or co-deposition.
- Substrate holder heating up to 800°C.
- Substrate rotation can improve thickness uniformity.
- Adjustable substrate to evaporation source spacing.
- Shutters are installed each evaporation source and substrate.
Chamber
- Flexible chamber sizes depend on substrate size and applications.
- Full-width opening door integrated two viewports with shutters for observing substrate and thermal sources.
- Ultimate vacuum of chamber about 10-8 Torr.
Options
- Intergrated with Load-Lock, robot arm, glove box.
- Combined with Ion-source, for plasma cleaning or assisted deposition.
- Substrate cooling.
- Residual gas analy
Brand
SYSKEY TECHNOLOGY Co., Ltd.
Product Number
Metal-Thermal-sys
Status
Request information