Syskey

Metal Thermal

Metal Thermal
Syskey

Metal Thermal

Flexible substrate size up to 12 inch wafer in diameter or 470 x 370 mm2 glass
 Substrate holder heating up to 800°C
Excellent thin-film uniformity of less than ±3%.

The evaporation source using electric heating can be used to deposit most organic and inorganic thin films, among which the resistance Joule method is the most common.

 

Applications

  • Metal materials research.
  • Nano film.
  • Solar-cell.

 

Configurations

  • Flexible substrate size up to 12 inch wafer in diameter or 470 x 370 mm2 glass.
  • Full-width opening door (HV chamber) integrated two viewports with shutters for observing substrate and evaporation sources.
  • Excellent thin-film uniformity of less than ±3%.
  • Multiple sources with sequential operation or co-deposition.
  • Substrate holder heating up to 800°C.
  • Substrate rotation can improve thickness uniformity.
  • Adjustable substrate to evaporation source spacing.
  • Shutters are installed each evaporation source and substrate.

 

Chamber

  • Flexible chamber sizes depend on substrate size and applications.
  • Full-width opening door integrated two viewports with shutters for observing substrate and thermal sources.
  • Ultimate vacuum of chamber about 10-8 Torr.

 

Options

  • Intergrated with Load-Lock, robot arm, glove box.
  • Combined with Ion-source, for plasma cleaning or assisted deposition.
  • Substrate cooling.
  • Residual gas analy