SYSKEY TECHNOLOGY Co., Ltd.

In-Line Sputtering Deposition System

In-Line Sputtering Deposition System
SYSKEY TECHNOLOGY Co., Ltd.

In-Line Sputtering Deposition System

Vertical or horizontal sputtering
 Excellent thin-film uniformity of less than ±5%
 Mass flow controllers with highly uniform gas distribution
 Substrate heating up to 400°C with stable temperature control

In-Line Sputtering Deposition System is that substrates passed linearly beneath one or more sputter cathodes to acquire their thin film coating.

 

Applications

  • Nanotechnology.
  • Product QC & QA.
  • Materials research.
  • Solar-cell.
  • Touch panel.
  • TFT-LCD.
  • Oxide, Nitride and Metal materials research.

 

Configurations

  • Flexible substrate size up to 1100 x 1300 mm2 (glass).
  • Excellent thin-film uniformity of less than ±5%.
  • High Deposition Rate ≥ 250 nm/min and high efficiency cathode.
  • Sputter power: RF 5kW, DC or pulsed-DC max 20kW.
  • Mass flow controllers with highly uniform gas distribution.
  • Substrate heating up to 400°C with stable temperature control.
  • Vertical or horizontal sputtering.

 

Chamber

  • Flexible chamber sizes depend on substrate size and applications.
  • Full range vacuum gauge with display and Baratron gauge for closed-loop pressure control.
  • Ultimate vacuum of chamber about 10-7Torr.

 

Options

  • Carrier return system.
  • Robot for auto loading.
  • Extra spare port for OES, RGA or extra process monitoring.
  • Intergrated with Load-Lock, robot arm, glove box.
  • Combined with Ion-source, thermal source, E-beam, etc.
  • RF or DC bias switching.
  • Thickness monitor.
  • Substrate RF plasma cleaning.
  • Extra spare port for OES, RGA or extra process monitoring.