SYSKEY TECHNOLOGY Co., Ltd.
In-Line Sputtering Deposition System
SYSKEY TECHNOLOGY Co., Ltd.
In-Line Sputtering Deposition System
Vertical or horizontal sputtering
Excellent thin-film uniformity of less than ±5%
Mass flow controllers with highly uniform gas distribution
Substrate heating up to 400°C with stable temperature control
In-Line Sputtering Deposition System is that substrates passed linearly beneath one or more sputter cathodes to acquire their thin film coating.
Applications
- Nanotechnology.
- Product QC & QA.
- Materials research.
- Solar-cell.
- Touch panel.
- TFT-LCD.
- Oxide, Nitride and Metal materials research.
Configurations
- Flexible substrate size up to 1100 x 1300 mm2 (glass).
- Excellent thin-film uniformity of less than ±5%.
- High Deposition Rate ≥ 250 nm/min and high efficiency cathode.
- Sputter power: RF 5kW, DC or pulsed-DC max 20kW.
- Mass flow controllers with highly uniform gas distribution.
- Substrate heating up to 400°C with stable temperature control.
- Vertical or horizontal sputtering.
Chamber
- Flexible chamber sizes depend on substrate size and applications.
- Full range vacuum gauge with display and Baratron gauge for closed-loop pressure control.
- Ultimate vacuum of chamber about 10-7Torr.
Options
- Carrier return system.
- Robot for auto loading.
- Extra spare port for OES, RGA or extra process monitoring.
- Intergrated with Load-Lock, robot arm, glove box.
- Combined with Ion-source, thermal source, E-beam, etc.
- RF or DC bias switching.
- Thickness monitor.
- Substrate RF plasma cleaning.
- Extra spare port for OES, RGA or extra process monitoring.
Brand
SYSKEY TECHNOLOGY Co., Ltd.
Product Number
In-Line-Sputter-Sys
Size
up to 1100 x 1300 mm2 (glass)
Status
Request information