EPAD® Thermal Formed Wafer Cushion 6" (150 mm)

6" (150mm) ePAD® Wafer Cushion

ePAD™ thermal formed wafer cushions – Particle free, vacuum formed, cushioning material for wafer stack

Specifications:

• ePAK description: eWP6-150-5-eM-20-BLK
• For 6" (150mm) substrates
• Material: Propietary conductive PS
• Diameter: 150 mm
• Thickness: 5 mm
• Particle-free vacuum formed cushioning