EPAD® Thermal Formed Wafer Cushion

6" (150mm) ePAD® Wafer Cushion

ePAD™ thermal formed wafer cushions – Particle free, vacuum formed, cushioning material for wafer stack

Specifications:

• ePAK description: eWP6-150-5-eM-20-BLK
• For 6" (150mm) substrates
• Material: Proprietary Conductive PS
• Diameter: 150 mm
• Thickness: 5 mm
• Particle-free vacuum formed cushioning

Cleanroom bagged per 50 pieces (P1)

ePAD® Wafer protection system
High performance alternative to foam-based solutions

• Made from proprietary, low-ionic, flexible, conductive polystyrene
• Ideal for both Cu and Al metallized wafers
• Best choice for both long and short term storage needs
• Available for 6”, 8” and 12” wafer sizes