EPAD® Thermal Formed Wafer Cushion 12" (300 mm)

12" (300 mm) ePAD® Wafer Cushion
ePAK code: eWP12-300-5-eM-20-BLK

ePAD™ thermal formed wafer cushions – Particle free, vacuum formed, cushioning material for wafer stack

Specifications:

• Material: Proprietary Conductive PS
• Diameter: 300 mm
• Thickness: 5 mm
• Particle-free vacuum formed cushioning