E-Beam Evaporation System

E-beam deposition system is a method of using electron beam generated from an electron source in a vacuum to material, and heating and evaporating it so that the evaporated material forms a thin film on the substance.

Applications

• Optoelectronic material (LED/Laser Diode).
• Communication device.
• Semiconductor device.

Configurations

• Flexible substrate size up to 12 inch wafer in diameter.
• Single wafer or multi wafers(2”x 32 pcs, 4”x 16pcs, 6”x 6pcs, 8”x 4pcs).
• Excellent thin-film uniformity of less than ±3%.
• Multi-pocket rotary e-beam sources (1/2/4/6 crucibles) with water cooled crucible.
• Auto deposition rate control.
• Multiple sources with sequential operation or co-deposition.
• Substrate holder-cooling (nitrogen liquid down to -70°C) or heating (up to 800°C).

Chamber

• Constructed from 304 stainless steel water cooled via external welding stainless steel 304.
• Full-width opening door (HV chamber) integrated two viewports with shutters for observing substrate and evaporation sources.
• Ultimate vacuum of chamber about 10^-8 Torr.

Options

• Intergrated with Load-Lock, robot arm, glove box.
• Combined with ion-source, sputter gun, E-beam, plasma cleaning or assisted.