
ULTRON SYSTEMS
Ultron offers a wide range of value-oriented manual to fully automatic semiconductor assembly equipment and one of the largest selections of semiconductor adhesive plastic film for dicing and backgrinding processes.
Main activities:
- Die matrix expander
- Film applicator
- Film frame mounter
- Film remover
- Tape dicing grinding
- UV tape
- UV Curing
WAFER HANDLING

Die Matrix Expander

Film Applicator

Film Frame Mounter

Film Remover

Tape Dicing Grinding

Tape UV

UV Curing
WETPROCESS

Wafer Cleaning
The latest ULTRON SYSTEMS products
Wetprocess
UH119
Wafer Cleaning
ULTRON SYSTEMS
Up to 12" (300mm)
Semi-Automatic
wafer-handling
1004R
Tape Dicing Grinding
ULTRON SYSTEMS
130 Micron
Medium-High Tack
100 Meter Rolls
wafer-handling
1005R
Tape Dicing Grinding
ULTRON SYSTEMS
125 Micron
Medium Tack
100 Meter Rolls
wafer-handling
1007R
Tape Dicing Grinding
ULTRON SYSTEMS
80 Micron
Medium Tack
100 Meter Rolls
wafer-handling
1008R
Tape Dicing Grinding
ULTRON SYSTEMS
80 Micron
Medium-High Tack
100 Meter Rolls
wafer-handling
1009R
Tape Dicing Grinding
ULTRON SYSTEMS
80 Micron
Low Tack
100 Meter Rolls
wafer-handling
1020R
Tape UV
ULTRON SYSTEMS
95 Micron
PVC Film
100 Meter Rolls
wafer-handling
1027R
Tape UV
ULTRON SYSTEMS
175 Micron
Polyolefin Film
100 Meter Rolls