
ULTRON SYSTEMS
Ultron offers a wide range of value-oriented manual to fully automatic semiconductor assembly equipment and one of the largest selections of semiconductor adhesive plastic film for dicing and backgrinding processes.
Main activities:
- Die matrix expander
- Film applicator
- Film frame mounter
- Film remover
- Tape dicing grinding
- UV tape
- UV Curing
WAFER HANDLING

Die Matrix Expander

Film Applicator

Film Frame Mounter

Film Remover

Tape Dicing Grinding

Tape UV

UV Curing
WETPROCESS

Wafer Cleaning
The latest ULTRON SYSTEMS products
wafer-handling
1004R
Tape Dicing Grinding
ULTRON SYSTEMS
130 Micron
Medium-High Tack
100 Meter Rolls
wafer-handling
1005R
Tape Dicing Grinding
ULTRON SYSTEMS
125 Micron
Medium Tack
100 Meter Rolls
wafer-handling
1007R
Tape Dicing Grinding
ULTRON SYSTEMS
80 Micron
Medium Tack
100 Meter Rolls
wafer-handling
1008R
Tape Dicing Grinding
ULTRON SYSTEMS
80 Micron
Medium-High Tack
100 Meter Rolls
wafer-handling
1009R
Tape Dicing Grinding
ULTRON SYSTEMS
80 Micron
Low Tack
100 Meter Rolls
wafer-handling
1020R
Tape UV
ULTRON SYSTEMS
95 Micron
PVC Film
100 Meter Rolls
wafer-handling
1027R
Tape UV
ULTRON SYSTEMS
175 Micron
Polyolefin Film
100 Meter Rolls
wafer-handling
1042R
Tape UV
ULTRON SYSTEMS
98 Micron
Polyolefin Film
100 Meter Rolls












