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Film Applicator
(3)Film Remover
(2)Film Frame Mounter
(3)Die Matrix Expander
(2)UV Curing
(3)Tape Dicing Grinding
(6)Tape UV
(4)Diamond Wire
(2)Size
Up to 12" (300 mm)
Up to 8" (200 mm)
Type
Tabletop
Die Matrix Expander
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Grinding / Dicing
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Category
Film Applicator
(3)Film Remover
(2)Film Frame Mounter
(3)Die Matrix Expander
(2)UV Curing
(3)Tape Dicing Grinding
(6)Tape UV
(4)Diamond Wire
(2)Size
Up to 12" (300 mm)
Up to 8" (200 mm)
Type
Tabletop
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wafer-handling
UH130
Die Matrix Expander
ULTRON SYSTEMS
Up to 8" (200 mm)
Tabletop
wafer-handling
UH130-12
Die Matrix Expander
ULTRON SYSTEMS
Up to 12" (300 mm)
Tabletop