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Film Applicator
(3)Film Remover
(2)Film Frame Mounter
(3)Die Matrix Expander
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(4)Diamond Wire
(2)Size
100~140µm
230~250µm
Type
LED
Sunlight
Diamond Wire
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Grinding / Dicing
Refine
Category
Film Applicator
(3)Film Remover
(2)Film Frame Mounter
(3)Die Matrix Expander
(2)UV Curing
(3)Tape Dicing Grinding
(6)Tape UV
(4)Diamond Wire
(2)Size
100~140µm
230~250µm
Type
LED
Sunlight
Apply filters
wafer-handling
Diamond Wire (LED)
Diamond Wire
SAESOL
A diamond tool used in the wire-sawing step as part of the semiconductor wafering process; The main function is for slicing sapphire and silicon ingot.
230~250µm
LED
wafer-handling
Diamond Wire (Sunlight)
Diamond Wire
SAESOL
A diamond tool used in the wire-sawing step as part of the semiconductor wafering process; The main function is for slicing sapphire and silicon ingot.
100~140µm
Sunlight