Plasma Enhanced Chemical Vapor Deposition (PECVD)

The batch type Plasma Enhanced Chemical Vapor Deposition (PECVD) can provide energy for deposition reaction. Compare to traditional CVD method, it can deposit various films at lower temperature without reducing the quality of it.This system is specifically designed for parylene. The substrate of which can both rotate and orbit,  and can batch produce. Parylene film has the properties of high uniformity, high filling, high penetrability, etc. And can be applied on electro-optical package, PCB insolation.