Wafer pick thinned wafers (WHS-G4) 200 mm (8")

WHS-G4 Manual Mechanical Edge Grip for 200 mm Taiko Wafers

The WHS-G4 series is a precision-engineered manual wafer edge grip tool, specifically designed for the handling of 200 mm Taiko™-thinned wafers. This normally-closed, consistent-force mechanical pick ensures secure and gentle handling of fragile

Taiko wafers during critical semiconductor processes. Its compact profile and robust design make it an ideal solution for cleanroom environments.

Manufactured with antistatic POM (Polyoxymethylene) performance plastics, the WHS-G4 is built for long-term durability and mild chemical resistance in ISO 4 (Class 10) cleanroom settings. The tool features ESD-safe Perfluorocarbon wafer contact pads, which ensure inert and clean wafer contact, protecting the wafer surface from contamination and damage during manual handling.

The WHS-G4 is designed for precise 2.4mm edge-only handling, offering maximum protection for Taiko wafers, which are more prone to damage due to their ultra-thin structure. The consistent-force mechanism provides even pressure distribution along the wafer edge, minimizing the risk of breakage.

Available in configurations for both 200 mm and 300 mm wafers, the WHS-G4 is an essential tool for semiconductor manufacturing, ensuring safe, reliable wafer manipulation for delicate processes.

Manufactured in an ISO9001 certified facility and CE certified, the WHS-G4 meets stringent international standards for quality, performance, and safety, making it an indispensable tool for handling large, fragile Taiko wafers in cleanroom environments