Wafer Edge Polisher

Silicon Wafer Edge Polisher System

Main Polisher Unit, suitable for 8" (200mm) or 12" (300mm) wafers. Increase throughput and improve surface precision in the wafer manufacturing process, our silicon wafer edge polisher is now found all over the world. This edge polisher, compatible with 8 or 12 inch wafers, uses polishing tape with a fixed-abrasive; the tape is made by our own special manufacturing method and can be fed through the machine during polishing, making it possible to constantly polish with a new abrasive surface and also give a consistent polishing capability.

Advantages:

• High throughput for any type of wafer
• Improves surface precision
• Chemical free polishing
• Removes various types of films
• Can be introduced at any stage of the wafer manufacturing process

Machine size: 1620 (W) x 1550 (D) x 2300 (H)
Weight: 2500 kg
Supported wafer sizes: 8" and 12"

Edge shape processing:

Notch polishing 

Bevel polishing
Polishing by rotating the wafer and applying polishing film to the periphery. (Head pressure 5N-15N). Polishing head angle and polishing time ae adjustable (Grinding head angle setting range: ± 79 degree.

Compatible polishing film lineup