Sputter Coater

Sputter Coater

State-of-the-art Sputtering Systems come with water cooled rotating 8” platen and up to three off-axis planar magnetrons. The system is pumped with a turbomolecular pump and achieves low 10 -6 Torr within 15 minutes. RF or DC power is applied to the individual magnetron through an RF switch. Magnetron to substrate distance is adjustable in order to achieve desired uniformity and deposition rate. Rotating platen with off axis magnetrons provide means of achieving the best film uniformity. Crystal thickness monitor is provided for terminating process automatically.

Features:

 

• Stainless Steel, Aluminum or Bell Jar chambers
• 70, 250 or 500 l/sec turbomolecular pump backed with a mechanical or dry pump
• 13.5 MHz, 300-600 W RF and 1KW DC power supplies
• Crystal holder with<1 Å thickness resolution>
• Door with view port for easy wafer load and unload
• PC Controlled with LabVIEW
• Multiple levels of access with password protection
• Fully safety interlocked

Options:

 

 

• Up, Down and Side Sputtering
• RF, DC and Pulsed DC Sputtering
• Co-Sputtering, Reactive Sputtering
• Combinatorial Sputtering
• RF or DC bias (1000 V)
• Heated Platen up to 700 °C
• Thickness Monitor
• Substrate RF Plasma Cleaning
• Load Lock and Auto Wafer Load Unload

Applications:

 

 

• Metal and dielectric coating of wafers, ceramics, glass blanks and disk heads
• Optical and ITO coatings Hard coatings with high temperature platens and Pulsed DC power supplies
• Reactive sputtering with RF plasma discharge

Models:

 

 

• 4000 PC Controlled, Stand Alone System
• 3500 PC Controlled, Compact Stand Alone System
• 3000 PC Controlled, Table Top

Dual Systems:

 

 

• 4000 Sputtering and RIE System
• 4000 Sputtering and PECVD System
• 4000 Sputtering and Thermal Evaporator System