POLOS

SPIN200x Advanced - Spin coater POLOS®

POLOS

SPIN200x Advanced - Spin coater POLOS®

Choose option:

Unique outer shell and drain design to switch between table-top and in-deck model in-field

Easy chamber access

Auto Lid

Liquid filter trap

Lid lock and vacuum sensor for user safety

Product description

Specifications

Datasheet & videos

The POLOS® SPIN200x is a 200 mm spin processor designed for precise and repeatable substrate processing. It combines accurate speed control with a flexible platform that can be configured for laboratory use, R&D environments or integration into automated production equipment.

The process chamber is available in Natural Polypropylene (NPP) or PTFE to suit different chemical requirements. Both Standard and Advanced configurations are available, allowing users to select the functionality that best matches their process.

Supports multiple substrate formats
The SPIN200x can process round wafers up to 200 mm (8") as well as square substrates up to 150 × 150 mm. This makes it a practical solution for applications involving different wafer materials, sample geometries and process conditions.

Typical applications include:

Coating
Cleaning
Rinse & dry
Developing
Etching
PDMI and related processes

Adaptable to your setup
The SPIN200x can be installed as a standalone tabletop system or integrated directly into a process deck. Its modular construction, optimized drainage and range of optional accessories make it easy to adapt the system as process requirements change.

A central mounting point accommodates a syringe or dispense nozzle, while additional options allow the system to be configured for more advanced dispensing requirements.

Ready for automated wafer handling
Automation is built into the SPINx platform. The SPIN200x allows the motor's home position to be programmed for accurate alignment with robotic handling equipment. Its elevated vacuum chuck also provides unobstructed access to the substrate, making loading and unloading straightforward with tweezers, vacuum tools or robotic end-effectors.

These features help support consistent automated handling while minimizing unnecessary contact with the substrate.

Built-in protection for the vacuum system
Process liquids can pose a risk to the vacuum and drive components if they enter the vacuum path. The SPIN200x addresses this with an integrated liquid filter trap positioned between the process chamber and vacuum system.
The trap collects accidental fluid ingress before it reaches sensitive components, including the vacuum sensor, drive unit and ServoBL Controller. A removable collection jar can be inspected from outside the system, making routine checks and preventative maintenance simple.

SPIN200x hardware specifications

Process chamber