KxS

Process Refractometer for concentration monitoring 100 1" - PFA - PUS (Pillar connect)

KxS

Process Refractometer for concentration monitoring 100 1" - PFA - PUS (Pillar connect)

Choose your size:
The industry standard for semiconductor fab chemical monitoring
Monitoring a wide range of critical semiconductor chemicals
Applications: Chemical blend checksum, Hard mask etching, Silicon wet etch, Titanium etch, Back side poly etch and Post-CMP

INLINE CONCENTRATION MONITOR provides real-time measurement in critical processes of semiconductor wet chemical applications. The instrument integration to process environments and control systems with industrial standard communication protocols is flexible with stand-alone refractometer setups, as well as optional modular connection units and external displays.

Our semiconductor fab chemical monitor is ideal for a variety of applications, including:

  • Chemical blend checksum of SC-1 and SC-2
  • Hard mask etching with NH3 water mixes
  • Silicon wet etch with 50% KOH
  • Titanium etch with H2SO4:HNO3:H3PO4 mixes
  • Back side poly etch with HF:HNO3 mixtures
  • Post-CMP cleans with various mixtures

Our technology is capable of monitoring a wide range of critical semiconductor chemicals, including but not limited to:

  • Hydrogen peroxide (H2O2)
  • Ammonium hydroxide (NH3 water)
  • Dilute hydrofluoric acid (HF)
  • Phosphoric acid (H3PO4)
  • Hydrochloric acid (HCl)
  • Sodium hydroxide (NaOH)
  • Sulfuric acid (H2SO4)
  • N-methyl pyrrolidone (NMP)
  • Tetramethylammonium hydroxide (TMAH)
  • Iso-propyl alcohol (IPA)
  • Potassium hydroxide (KOH)
  • Nitric acid (HNO3)
  • Polyethylene glycol (PEG)
  • Citric acid (C6H8O7)
  • Acetic acid (CH3COOH)


 
Model: DCM-10 including Flow Cell Body

  • Refractive Index range, standard: Full range, nD=1.3200...1.5300 (equival by definition to 0...100%wt)
  • Output units: RIU (refractive index unit) / Conc% / g/cm3
  • Measurement precision: ± 0.025 %wt
  • Speed of response: 1s undamped
  • Optics: No mechanical adjustments and digital measurement with 4K camera element, 589 nm wavelength (sodium D-line) light emitting diode (LED), built-in Pt-1000 (1/3B) temp sensor (linearization according to IEC 751)
  • Temperature compensation: Automatic, individual zero point calibration
  • Calibration: NIST traceable calibration, verification with standard RI liquid
  • Wetted parts: PFA, Sapphire, ECTFE Secondary sealing: Kalrez 6375UP o-ring
  • Sensor housing: polypropylene(PP)
  • Process temperature: 0°C (-4°F)...85°C (185°F)
  • Ambient temperature: 0°C (-4°F)...45°C (113°F)
  • Sensor protection class: IP67, Nema 4X
  • Installation: Indoor, unclassified area
  • Sensor weight: 330g (11.6 oz)

 
Outputs and connections:

  • Digital M12 connector: 24VDC power supply and Modbus TCP/IP, conversion to other protocols with converter module, cable lengths 2-10m (6-33ft), max, 70m(230ft)
  • Analog M12 connector: 24VDC power supply and 2x independent 4-20mA outputs, normal cable length 10m(33ft), max, 200m(660ft). Max. load 1000 Ohm
  • Sensor power consumption: max. 2.5W
  • Options: Modular Connection Unit, 7” or 15” HMI, full color touch screen interface
  • Communication protocol converter: from Modbus TCP to Ethernet IP or Profinet

 

Options

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