GaAs/SiC Wafer Edge Polisher System
GaAs/SiC Wafer Edge Polisher System
GaAs/SiC Wafer Edge Polisher System
SFF-Serie is capable of polishing O.F and bevel of 2-8 inches wafers and shows high machining efficiency for difficult-to-cut materials such as SiC and GaN.
Advantages:
- Low damage + High rate
- Capable of removing layers on the wafer edge
- Easy utility connection
- Capability to create various edge shapes
- Capable of rough and fine polish
- Top edge polish available
- Chemical free process
Equipped with new centering unit, SFF-serie is now able to process transparent wafers such as glass. It is also capable of measuring diameter of wafers before/after processing.
Together with Mipox polishing film, SFF-200TX can achieve both edge beveling and fine polishing.
In conventional wafer edge grinding/polishing process, there were over-polishing of O.F sides issues. Our new mechanism prevents such over-polishing.
TUNeDGE SFF has a beveling mechanism specifically designed for wafers that have polishing characteristics that differ depending on crystal orientation. SFF-200TX can set different polishing conditions in accordance with the crystal orientation, enabling uniform beveling process.
Machine size: 932 (W) x 21530 (D) x 1721 (H)
Weight: 1500 kg
Supported wafer sizes: 2"-8"
Edge shape processing:
Notch polishing
Bevel polishing
Polishing by rotating the wafer and applying polishing film to the periphery. (Head pressure 5N-15N). Polishing head angle and polishing time ae adjustable (Grinding head angle setting range: ± 79 degree.
Compatible polishing film lineup
