FPD-PVD

It has 4 independent sputtering chambers, allowing customers to arbitrarily match the deposited materials, while maintaining a quick and low-cost system.

Applications

• TFT-LCD.
• Solar-cell.
• Touch panel.
• Oxide, Nitride and Metal materials research.

Configurations

• Flexible substrate size up to 550 x 650 mm² (glass).
• Excellent thin-film uniformity of less than ±5%.
• Substrate heating up to 400°C with stable temperature control.

Options

• Cassette port.
• Substrate plasma cleaning.
• Extra spare port for OES, RGA or extra process monitoring.