ePAD™ wafer platforms – Provides the flat surface required for the proper function of the ePAD system and is a High performance alternative to foam-based solutions
Specifications
ePAK description: eFP8-200-0.8-eM-20-BLK
For 8" (200mm) substrates
Material: Proprietary conductive PS
Diameter: 200 mm
Thickness: 0,8 mm
Cleanroom bagged per 10 pieces (P3)
(available in increments of 10 pieces)
