Vacuum Wands

Innovating Wafer & Die Handling with WHS Vacuum Wands: Leading ESD Vacuum Solutions

At WHS, we’re redefining cleanliness and antistatic performance in wafer handling and die handling through our versatile vacuum wand platform. As essential wafer handling tools, these systems address key needs where esd vacuum performance is critical. Whether you’re manipulating standard silicon wafers or specialty materials such as InP, SiC, GaAs, GaN, or Ge, our modular vacuum wand components, key pieces of wafer handling equipment and die handling equipment, can be configured to tackle the full spectrum of handling challenges in your fab.

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WHS-V6 & WHS-V7: Portable Vacuum Wand Powerhouses

  • WHS‑V6: A cordless, battery‑powered portable vacuum wand built for precision rescue and light‑volume work. Rated ISO Class 3, it runs on a user‑replaceable lithium‑ion pack—ideal for tasks requiring a semiconductor vacuum wand without tying into facility vacuum.
  • WHS‑V7: A bench‑top solution providing powerful esd vacuum capability for demanding, high‑volume tasks. Its integrated vacuum pump and robust battery deliver days of continuous operation at 800 mBar (23.6″ Hg), all while sustaining ISO Class 3 cleanliness. An automatic shut‑off stand keeps this robust wafer vacuum wand ready and protected between uses.

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Vacuum Tips

All WHS-V1 vacuum tips are compatible with WHS vacuum wands and handles, as well as most competitor products. WHS also offers custom vacuum tips upon request, tailored to specific customer needs.

Our wafer handling tools adapt to each stage:

  • For wafers from 50 mm to 300 mm
  • ESD-safe PEEK, heat-resistant up to 160°C
  • Cleanroom-tested and ready for use
  • Straight or bent (10°, 20°, 30°) options
  • Polyimide tips for high-temp applications

Customizable Handling Solutions

Our Vacuum wands, whether WHS-V6, WHS-V7 portables, or house-vacuum installed wands, are fully customizable and interchangeable to suit your unique requirements. WHS-V1 vacuum tips come in various sizes and materials, including antistatic PEEK, high-temperature Polyimide, and UHMW clean, non-marking material, suitable for small die up to 300 mm wafers. Additionally, the WHS product line offers thing and compound wafer variations that exert less stress compared to our standard models designed for full-thickness silicon.

WHS-V2 wand handles are thoughtfully designed with operator comfort in mind, molded from advanced antistatic cleanroom materials, while WHS-V3 coil cords are constructed from advanced conductive polyurethane materials, ensuring they remain lightweight, durable, and resistant to crimping. 

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End‑to‑End Wafer Handling Coverage

From raw wafer receipt through the stages of wafer handling like fab processing, sort‑test‑probe, and final die packaging, WHS offers vacuum wand kits that adapt to each stage of your workflow.

Our wafer handling tools adapt to each stage:

  • Vacuum wand for semiconductor wafer processing mounted on facility vacuum
  • Functioning independently
  • Plugging seamlessly into your existing automation or manual stations.

Universal Compatibility & Support

All WHS vacuum components integrate with major equipment brands, giving you flexibility when retrofitting or expanding. Our technical sales team stands ready to help you choose the optimal vacuum wand configuration for your wafer handling equipment needs and throughput requirements.