3. Wafer resizing/ down-sizing (coring)
SPS provides coring services for various material semiconductor wafers (e.g. Silicon, Glass, Silicon Carbide, Gallium Arsenide). After downsizing the wafer SPS can also do edge beveling and polishing processes to increase the yield of the post process (e.g. back grinding) by removing chipping from the wafer edge.
8” Si wafer ⇒ 3” wafers
Resizing of Single crystal SiC
Edge/top edge film removal processes for GaN on Si wafers
SPS can provide polishing processes for GaN wafers where also the top edge area of the wafers can be polished. This process can also be used for removing Epic defects.
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