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Edge Polish System
(2)
Edge Polish Tape
(1)
Wafer size
12 inch
Weight
± 3200 kg
Wafer thickness
775± 60 μm
Air pressure
0.5-0.8 MPa
Water pressure
0.2-0.4 MPa
Exhaust ventilation
Exhaust amount 300 m3 /hour
Edge Polish System
2
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Edge Polish
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Category
Edge Polish System
(2)
Edge Polish Tape
(1)
Wafer size
12 inch
Weight
± 3200 kg
Wafer thickness
775± 60 μm
Air pressure
0.5-0.8 MPa
Water pressure
0.2-0.4 MPa
Exhaust ventilation
Exhaust amount 300 m3 /hour
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polishing
Silicon Wafer Edge Polisher System
NME 123N
Edge Polish System
MIPOX
12 inch
± 3200 kg
775± 60 μm
0.5-0.8 MPa
0.2-0.4 MPa
Exhaust amount 300 m3 /hour
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polishing
GaAs/SiC Wafer Edge Polisher System
TUNeDGE SFF-200TX
Edge Polish System
MIPOX
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