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Wafer Scribing
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Material
Carbide laser wheel for cutting Si and Glass wafers
Diamond laser wheel for cutting SiC and Sapphire wafers
Wafer size
100 mm (4")
200 mm (8")
300 mm (12")
Maximum cut length
110 mm
210 mm
310 mm
Suitable thickness
0.05 mm ~ 3.0 mm

Wafer Scribing

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photolithography
POLOS Wafer Scriber
polos-wafer-scriber
Wafer Scribing
POLOS
POLOS Wafer Scriber
100 mm (4"), 200mm (8") or 300 mm (12")
110 mm - 310 mm
0.05 mm ~ 3.0 mm
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6 Sizes:
POLOS Wafer Scriber 12’’ - Diamond laser wheelPOLOS Wafer Scriber 4’’ - Diamond laser wheelPOLOS Wafer Scriber 12’’ - Carbide laser wheel
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