Wafer Coring / Size Reduction service

Mipox delivers advanced wafer coring and size reduction solutions for a wide range of semiconductor materials and applications. From device-attached silicon wafers to compound semiconductors such as SiC, we support both standard and highly specialized wafer formats. Our expertise extends to custom size reduction of irregularly shaped wafers, including half-inch and chip-shaped formats.

Whether supporting small R&D batches or medium-volume production, We offers flexible, high-precision processes designed to meet diverse technical requirements with consistent quality and reliability.

Method of Wafer Coring / Size Reduction:

• Laser cutting
• Laser Micro Jet, Blade, Cup wheel
• Abrasive grinding method (such as blade, mounted grinding wheel, and core drill methods)
• Others

Please request a quotation, and our sales managers will be pleased to support you in identifying the solution that best meets your requirements.