TBP

Vertical Wafer Transfer - Single/Mass

Vertical Wafer Transfer - Single/Mass

wafer-handling » Wafer Transfer » Vertical Wafer Transfer
TBP

Vertical Wafer Transfer - Single/Mass

Choose your size:

<strong>5" (125mm) Vertical Wafer Transfer - Single/Mass </strong>







Model: SWTS5







The SWTS-Series is designed for automatic wafer transfer. With this system it is possible to split, merge, sort, compress wafer-lots, or create individual wafer-mix as desired. The system is equipped with two load-ports and mechanical wafer notch/flat-aligners. The waferhandling is realized via edge gripping, so no vacuum is required. The system is equipped also with a automatic Mass Wafer Gripper to transfer a whole batch.







<strong>Specifications:</strong>



 



<ul>

<li>For 5" (125mm) Wafers</li>

<li>Wafer Thickness: 450um - 750um</li>

<li>Single and Mass Transfer Capabilities</li>

<li>No Vacuum Needed (Edge Gripping)</li>

<li>Vertical Transfer System</li>

<li>Cross Slotted Wafer Detection</li>

<li>Tabletop System or With Stand</li>

<li>Throughput up to 700 wph</li>

<li>Windows Operating System</li>

<li>ESD-Safe</li>

<li>RFID Cassette Identification on Request</li>

<li>Upgrade to Wafer Identification Possible</li>

<li>Full SECS/GEM Compliance</li>

</ul>







<strong>Applications:</strong>



 



 



<ul>

<li>Wafer Transfer</li>

<li>Compress to Top by Slot</li>

<li>Compress to Bottom by Slot</li>

<li>Invert by Slot</li>

<li>Individual Transfer-Function to progam custom recipes</li>

</ul>







<font color="#00B7EF">*** Note: Please specify cassette model numbers when ordering ***</font>







<u>Contact SPS-Europe for special requests!</u>