Antistatic conductive PEEK vacuum wand tip for handling of 100-200 mm wafers. Features 3° offset wide-wide 36 x 36mm vacuum pocket. Available in standard vacuum pocket (AP4N); standard pocket with backside insertion prevention bump (AP4B); thin wafer /compound wafer vacuum pocket (AP4C); and standard with special polyethylene touchpad (AP4U) for handling virgin, EPI, optical wafers, and front side contact applications. All versions are available straight (ST), bent 10° up (1U), bent 10° down (1D), bent 30° up (3U), or bent 30° down (3D) based on each wafer handling application. ISO 3 compatible.
