UH119 Pressure Cleaning System

UH119 Pressure Cleaning System

Features:

• Up to 8" (200mm) frame-mounted wafer capability
• Compact, small footprint floor-standing profile
• Fast and efficient cleaning is optimized through user programmable sequences
• Easily programmable microprocessor-based controller
• Repeatable, reliable, semiautomatic operation
• Exceptional cost/performance value

Specifications:

• Power: 115V/10A, 240V/5A
• Air: 6.2 l/min @ 60 psi
• Water: 1.5 l/min @ 25 psi
• Spindle Speed: 100 - 3.200 RPM (adjustable)
• Wafer offset: +/- 5° (20mm)

Dimensions:

• Height: 48"
• Width: 18"
• Depth: 27"