Silicon Wafer Edge Polisher System

Silicon Wafer Edge Polisher System

Increase throughput and improve surface precision in the wafer manufacturing process, our silicon wafer edge polisher is now found all over the world. This edge polisher, compatible with 6, 8, or 12 inch wafers, uses polishing tape with a fixed-abrasive; the tape is made by our own special manufacturing method and can be fed through the machine during polishing, making it possible to constantly polish with a new abrasive surface and also give a consistent polishing capability.

Advantages:

• High throughput for any type of wafer
• Improves surface precision
• Chemical free polishing
• Removes various types of films
• Can be introduced at any stage of the wafer manufacturing process