Mechanical Wafer Pick Edge grip

WHS-G1 Manual Mechanical Wafer Edge Gripper

The WHS-G1 series is a precision-engineered manual wafer edge gripper designed for safe, efficient handling of wafers with thicknesses ranging from 120 μm to 1000 μm.

This antistatic, normally-closed mechanical tool is ideal for applications where traditional backside contact methods are not suitable, such as bonded wafers, double topography, Taiko, TSV, MEMS, and optical wafers. The bottom gripper material is ESD-safe PEEK, offering longevity, antistatic protection, and chemical resistance in demanding cleanroom environments. Featuring a 3 mm perfluorocarbon elastomer front side touch pad, the WHS-G1 ensures secure wafer handling without risking scratches or contamination. Its ergonomic, weighted handle and easy-to-use trigger provide precise control and reduce operator fatigue during long periods of manual wafer handling. The design is optimized for SEMI Standard round substrates, making it versatile for both silicon and compound wafers.

The WHS-G1 is not only suitable for standard wafer handling tasks like manual transferring, sorting, and loading, but also excels in more specialized operations, such as rescuing wafers stuck inside process tools or automation systems. It can also be used for inspecting wafers for macro defects, particles, and scratches, with its edge-only handling method reducing the risk of contamination.

This gripper is a cost-effective alternative to vacuum wands and tweezers, providing superior handling without leaving scratches or debris. Manufactured in an ISO9001 and CE certified facility, the WHS-G1 meets international standards for safety and performance, offering a reliable solution for high-precision wafer handling in cleanroom environments.