Mechanical Wafer Pick Edge grip with spatula

WHS-G2 Manual Mechanical Wafer Pick with Spatula Knife Edge

The WHS-G2 series is an advanced manual wafer handling tool, designed specifically for applications requiring precise wafer manipulation on flat surfaces. A sister product to the WHS-G1, the WHS-G2 features a knife-edge spatula, ideal for lifting wafers from hotplates, platens, or vacuum chucks. This normally-closed, edge-only mechanical gripper accommodates wafers with thicknesses ranging from 120 μm to 1000 μm, ensuring secure handling in a variety of semiconductor processes.

The knife-edge spatula is compatible with surfaces up to 160°C, making the WHS-G2 an ideal solution for high-temperature wafer handling. The bottom gripper is constructed from ESD-safe PEEK for durability, antistatic protection, and chemical resistance. The top gripper side of the tool features a 3 mm perfluorocarbon elastomer touchpad, which provides gentle, secure contact without risking scratches or contamination.

The ergonomic handle and easy-to-use trigger design enhance operator control and reduce fatigue, enabling safe handling of SEMI Standard round substrates, both silicon and compound wafers. In addition to standard wafer handling tasks such as manual transferring and sorting, the WHS-G2 is suited for specialty handling applications, including bonded and Taiko wafers, optical components, and MEMS devices.

Offering a cost-effective alternative to vacuum wands and tweezers, the WHS-G2 ensures precise handling without scratching or leaving debris. Manufactured in an ISO9001certified facility and with CE certification, the WHS-G2 meets international standards for performance and safety, making it an indispensable tool in cleanroom environments.