SYSKEY TECHNOLOGY Co., Ltd.

Lift-off

Lift-off
SYSKEY TECHNOLOGY Co., Ltd.

Lift-off

Flexible substrate size up to 12 inch wafer in diameter
 Excellent thin-film uniformity of less than ±3%
 Multiple sources with sequential operation or co-deposition

Lift-Off is a process of creating pattern on the substrate surface and opposite to etching process.

 

Applications

  • LIFT-OFF process.

 

Configurations

  • Flexible substrate size up to 12 inch wafer in diameter.
  • Excellent thin-film uniformity of less than ±3%.
  • Multi-pocket rotary e-beam sources (1/2/4/6 crucibles) with water cooled crucible.
  • Auto deposition rate control.
  • Multiple sources with sequential operation or co-deposition.
  • Substrate holder-cooling (liquid nitrogen down to -70°C).

 

Chamber

  • Flexible chamber sizes depend on substrate size and applications.
  • Chamber height ≧650 mm.
  • Ultimate vacuum of chamber about 10-8 Torr.

 

Options

  • Intergrated with Load-Lock, robot arm, glove box.