Lift-off

Lift-Off is a process of creating pattern on the substrate surface and opposite to etching process.

Applications

• LIFT-OFF process.

Configurations

• Flexible substrate size up to 12 inch wafer in diameter.
• Excellent thin-film uniformity of less than ±3%.
• Multi-pocket rotary e-beam sources (1/2/4/6 crucibles) with water cooled crucible.
• Auto deposition rate control.
• Multiple sources with sequential operation or co-deposition.
• Substrate holder-cooling (liquid nitrogen down to -70°C).

Chamber

• Flexible chamber sizes depend on substrate size and applications.
• Chamber height ≧650 mm.
• Ultimate vacuum of chamber about 10^-8 Torr.

Options

• Intergrated with Load-Lock, robot arm, glove box.