ESPRO® Megasonic Nozzle - Shower Type

Applications

Shower type megasonic cleaning integrates the megasonic transducer into the nozzle. The megasonic nozzle sprays the fluid with megasonic energy onto the surface of substrates such as wafers to accomplish the cleaning process. The ad-vantage of shower type megasonic cleaning is that it can directly make the point to point process on the substrate surface. The megasonic focus point can be directly put onto the wafer surface and then it realizes the entire surface process by moving the wafer and megasonic nozzle. 

Frequency: 1MHz, 2MHz, 3MHz
Max. Power: 40W
Housing Material: PEEK, PCTFE
Resonator Material: Quartz
Flow Rate: >0.9L/min
Active Area: 5-10mm(Diameter)
Ambient Temperature: 10-40 °C

Benefits

• Single point spray megasonic cleaning, compared with traditional tank cleaning, can solve the problem of secondary pollution of cleaning solution.
• Extremely low ultrasonic cavitation effect, no damage to device surface, suitable for megasonic wafer cleaning
• Ultra-high megasonic cleaning precision, which can remove dirt particles in 0.2 micron on the object surface
• Made of non-metallic high anti-corrosion materials, suitable for various acid-base and organic solvents
• Quartz or sapphire coupling layer technology, no risk of impurities falling off the device
• Unique transducer bonding technology gives higher stability and durability
• Megasonic cleaning generator using the third-generation semiconductor technology, fully realizing digital high-frequency and high-power drive