CMP Pad Conditioner Downforce Monitoring Interface

Embrace the power of Industry 5.0 to connect your equipment, manufacturing process and personnel closer than ever before. SPS provides smart sensors that employ high speed measurements in conjunction with edge processing to enhance your predictive maintenance capabilities beyond what is achievable with the existing data collection and analysis on your equipment.

BENEFITS

• Reduces wafer scrap and rework
• Eliminates unscheduled maintenance downtime
• Lowers equipment cost of ownership
• Improves mean-time to repair
• Fast same-day integration

Real-time downforce measurements 
Monitor the pad conditioner downforce during wafer polishing

True predictive maintenance 
Alert manufacturing personnel when equipment maintenance is required before it adversely affects your polishing rates

Fault prediction  
Bearing wear/failure Pneumatic cylinder wear/failure Pneumatic pressure variation Poor rebuild quality Other mechanical degradation

Fault classification made easy 
Immediately know if the pad conditioner is the cause of your process variation

SPECIFICATIONS

Downforce Interface Module

• 4-channels
• Adjustable offsets and amplification
• Thermistor temperature compensation input
• Measurement outputs 0-3.3V
• Operating temperature -10 to 70°C
• Input power 5VDC 200mA
• DIN rail mountable
• Dimensions 11.4L x 7.6W x 4.6H cm

Thermistor Sensor

• NTC 10kΩ
• Operating temperature -40 to 150°C
• 3.7mm Ø mounting hole
• Dimensions 16.3L x 7.1W x 1.0H mm

Thin Film Load Cell Sensor

• Full Bridge Strain Gauge
• Resistance 1000Ω
• Hysteresis 0.03% R.O.
• Repeatability 0.05% R.O.
• Nonlinearity 0.15% R.O.
• Creep 0.05 R.O. (30 mins)
• Temperature effect 0.03% R.O/°C
• Temperature range -10 to 70°C
• Cable 0.3m
• Dimensions 65.0L x 6.4W x 0.45H mm