After resizing, wafer edges and notches are highly susceptible to damage, and cutting marks can easily remain. To address this, Mipox applies an advanced chamfering process utilizing its proprietary polishing film technology. This low-damage approach optimizes edge geometry and surface roughness, significantly enhancing wafer integrity and contributing to improved yields during subsequent wafer processing and operation.
Before polishing: Wafer with chipping caused by cutting (see photo)
After polishing: Chamfering to improve strength (see photo)
Please request a quotation, and our sales managers will be pleased to support you in identifying the solution that best meets your requirements.
