Ceria Slurry

Formulated with proprietary ceria abrasive particles, this solution is engineered for dielectric material (oxide, OX) removal and planarization, including applications such as Shallow Trench Isolation (STI) structure formation. It delivers a high oxide removal rate, excellent planarization efficiency, and low dishing, while maintaining low defectivity to support superior  quality. Optimized for demanding semiconductor fabrication environments, it enables precise, reliable performance in advanced process integration.