Batch Type PECVD

The batch type Plasma Enhanced Chemical Vapor Deposition (PECVD) can provide energy for deposition reaction.

 

Applications

• Wear coatings for medical & commercial products.
• Encapsulation, isolation.
• Scratch-resistant displays.

Configurations

• Flexible substrate size.
• Multi wafers Process.
• Excellent thin-film uniformity of less than ±3%.
• Mass flow controllers with highly uniform gas distribution.
• Direct and remote capacitive coupled plasma (CCP).

Chamber

• Flexible chamber sizes depend on substrate size and applications.
• Chamber temperature control by using heater jacket, Cooling water, Hot water.