195/210 mm - Hoop Ring,

ePAK’s Hoop Rings and Expansion Rings are essential components in the semiconductor wafer handling process, offering robust and customizable solutions for securing wafers during transport and storage. These rings are designed to fit a wide range of wafer sizes, from 140mm to 248mm, and are manufactured from high-quality materials such as modified polycarbonate (MPC). This material choice ensures durability and provides the necessary protection against physical damage and environmental contaminants, which are critical concerns in semiconductor manufacturing.

One of the standout features of ePAK’s Hoop Rings is their flexibility in customization. Available in various sizes and colors, these rings can be tailored to meet the specific needs of semiconductor manufacturers, allowing for easier identification and process management. Additionally, ePAK offers both vacuum-formed and injection-molded versions, providing options that cater to different manufacturing preferences and requirements. The ability to customize these rings not only enhances their functionality but also integrates seamlessly into existing systems, ensuring that manufacturers can upgrade their wafer handling processes without significant disruptions.

Moreover, these Expansion Rings are engineered to work in conjunction with automated wafer handling and shipping systems, making them an ideal choice for companies looking to streamline their operations while maintaining high standards of wafer protection. The robust design of these rings ensures that wafers are securely held in place during transport, minimizing the risk of movement that could lead to damage.

By incorporating ePAK’s Hoop Rings and Expansion Rings into their operations, semiconductor manufacturers can significantly enhance the safety and reliability of their wafer handling processes, ensuring that wafers remain in pristine condition from the start of production to the final stages of assembly.