Silicon Release Agent-free uniform thickness medium-high tack adhesive film for direct lamination to the wafer backside. Suitable for use in wafer dicing operations. The base film is op PVC with an Acrylic adhesive.
Features:
Does not contain any silicone release agents
Consistent adhesive properties and cleaner process
Uniformity, linear elongation properties and adhesive similar to our other high quality films
Type: Medium-High Tack
Thickness: 80-micron
Supplied in 100-meter (330 ft.) rolls without backing liner
Available in following standard widths:
6", 6.5", 7", 7.5", 8", 8.5", 9", 9.5", 10", 10.5", 11", 11.5", 12", 12.5", 13", 13.5", 14", 15", 16"
