Products

As the functional size of the device is further reduced, further use of ALE is required to achieve its required accuracy.

The AT200M utilizes semiconductor grade components. Metal-sealed lines and a robust PLC driven user interface, fast cycling and high-quality single component th

Table-Top Atomic Layer Deposition ALD System, suitable for up to 5 lines. Substrate size up to 4" (100mm) diameter (Other Wafer Sizes on Request!)

Table-Top Atomic Layer Deposition ALD System, suitable for up to 5 lines. Substrate size up to 6" (150mm) diameter

The batch type Plasma Enhanced Chemical Vapor Deposition (PECVD) can provide energy for deposition reaction.

Co-sputtering is simultaneous coating from two or multiple sputtering targets. It is used for compound - alloy or composite material.

Diamond-like Carbons are formed from combining high concentrate sp3 bonding (Diamond) with low concentrate sp2 bonding.

E-beam deposition system is a method of using electron beam generated from an electron source in a vacuum to material, and heating and evaporating it so