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polishing
Wafer Polishing & Coring Services
00112233
Polishing bonding service
MIPOX
Edge Polishing | Cleaning Service
Surface Polishing | Permant Bonding Service
Wafer Re-Sizing Service
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polishing
Size: dia 4" x 6.35 mm(T)
Cr sputtering target
Sputter Coater options
SYSKEY TECHNOLOGY Co., Ltd.
Up to 3" (75mm)
Custom Solution
Cost Efficient Designs
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polishing
CS4000-50-S10-2
CS4000-50-S10-2
Edge Polish Tape
MIPOX
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polishing
Silicon Wafer Edge Polisher System
NME 123N
Edge Polish System
MIPOX
12 inch
± 3200 kg
775± 60 μm
0.5-0.8 MPa
0.2-0.4 MPa
Exhaust amount 300 m3 /hour
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polishing
GaAs/SiC Wafer Edge Polisher System
TUNeDGE SFF-200TX
Edge Polish System
MIPOX
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