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WHS-G1-23
Wafer Edge Pick
WHS
WHS-G1 Serie MCP2-8 A normally closed (consistent-Force) edge exclusion mechanical pick For handling 50 mm up to 200 mm round substrates from the wafer edge.
50-76 mm
Edge grip
Perfluorocarbon 3 mm front side touchpad
handling-shipping
WHS-G1-45
Wafer Edge Pick
WHS
WHS-G1 Serie MCP2-8 A normally closed (consistent-Force) edge exclusion mechanical pick For handling 50 mm up to 200 mm round substrates from the wafer edge.
100-125 mm
Edge grip
Perfluorocarbon 3 mm front side touchpad
handling-shipping
WHS-G1-6
Wafer Edge Pick
WHS
WHS-G1 Serie MCP2-8 A normally closed (consistent-Force) edge exclusion mechanical pick For handling 50 mm up to 200 mm round substrates from the wafer edge.
150 mm
Edge grip
Perfluorocarbon 3 mm front side touchpad
handling-shipping
WHS-G1-8
Wafer Edge Pick
WHS
WHS-G1 Serie MCP2-8 A normally closed (consistent-Force) edge exclusion mechanical pick For handling 50 mm up to 200 mm round substrates from the wafer edge.
200 mm
Edge grip
Perfluorocarbon 3 mm front side touchpad
handling-shipping
WHS-G2-23
Wafer Edge Pick Spatula
WHS
WHS-G2 Serie MCP2-6-S A normally closed (consistent-Force) edge exclusion mechanical pick For handling 50 mm up to 200 mm round substrates from the wafer edge.
50-76 mm
Edge grip with spatula
Perfluorocarbon 3 mm front side touchpad
handling-shipping
WHS-G2-45
Wafer Edge Pick Spatula
WHS
WHS-G2 Serie MCP2-6-S A normally closed (consistent-Force) edge exclusion mechanical pick For handling 50 mm up to 200 mm round substrates from the wafer edge.
100-125 mm
Edge grip with spatula
Perfluorocarbon 3 mm front side touchpad
handling-shipping
WHS-G2-6
Wafer Edge Pick Spatula
WHS
WHS-G2 Serie MCP2-6-S A normally closed (consistent-Force) edge exclusion mechanical pick For handling 50 mm up to 200 mm round substrates from the wafer edge.
150 mm
Edge grip with spatula
Perfluorocarbon 3 mm front side touchpad
handling-shipping
WHS-G2-8
Wafer Edge Pick Spatula
WHS
WHS-G2 Serie MCP2-6-S A normally closed (consistent-Force) edge exclusion mechanical pick For handling 50 mm up to 200 mm round substrates from the wafer edge.
200 mm
Edge grip with spatula
Perfluorocarbon 3 mm front side touchpad