Handling & Shipping

Product for safe substrate handling, transfer or sorting
of wafers. Solutions for shipping and storage of substrates.

Diamond Wire

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Handling-Shipping
Diamond Wire (LED)
Diamond Wire (LED)
Diamond Wire
SAESOL
Diamond Wire (LED) Handling-Shipping » Grinding / Dicing » Diamond Wire
A diamond tool used in the wire-sawing step as part of the semiconductor wafering process; The main function is for slicing sapphire and silicon ingot.
LED
230~250µm
Ingot Slicing
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Handling-Shipping
Diamond Wire (Sunlight)
Diamond Wire (Sunlight)
Diamond Wire
SAESOL
Diamond Wire (Sunlight) Handling-Shipping » Grinding / Dicing » Diamond Wire
A diamond tool used in the wire-sawing step as part of the semiconductor wafering process; The main function is for slicing sapphire and silicon ingot.
Sunlight
100~140µm
Ingot Slicing
View product