Wafer handling products
Vacuum Tip PEEK 76-150 mm Compound/Thin 30° Bent Down
Wafer handling products
Vacuum Tip PEEK 76-150 mm Compound/Thin 30° Bent Down
Choose your size:
SEMI Standard Wafer Handling
Antistatic PEEK Material
Straight or bend
Antistatic conductive PEEK vacuum wand tip for handling of 76-150 mm wafers. Features 3° offset wide-short 30 x 19mm vacuum pocket. Available in standard vacuum pocket (AP3N) and thin wafer /compound wafer vacuum pocket (AP3C). All versions are available straight (ST), bent 10° up (1U), bent 10° down (1D), bent 30° up (3U), or bent 30° down (3D) based on each wafer handling application. ISO 3 compatible.
Brand
Wafer handling products
Product Number
WHS-V1-AP3C3D
Remarks
30° Bend Down
Material
Antistatic PEEK
Size
76-150 mm
Type
Press Fit
Bend
30° Bend Down
Status
Request information
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