Tyvek® Separator

• Material Variants: Available in Anti-static spun PO (Tyvek®) and carbon, conductive PS.
• Size Options: Comes in 100, 150, 200, and 300 mm sizes to accommodate different wafer diameters.
• Automated Process Suitability: Carbon separators are ideal for automation due to their rigidity.
• Protection Between Wafers: Ensures safe spacing and minimizes contact damage.
• Interleaf Diameter Precision: Tailored to fit snugly around each wafer size.
• Adaptability: Suitable for use in both wafer canisters and wafer jars.
• Static Protection: Tyvek® offers anti-static properties to safeguard sensitive wafers.

Wafer separators, essential in semiconductor packaging, come in two primary materials: Anti-static spun PO (Tyvek®) and carbon, conductive material. These separators, available in 100, 150, 200, and 300mm sizes, are crucial for ensuring protection between wafers in both canisters and jars. The Tyvek® separators are known for their cost-effectiveness and widespread use, making them a popular choice in the industry. On the other hand, carbon separators are recognized for their chemical stability and rigidity and compatible use with the automation industry, which enhances their suitability for certain wafer types. The choice of material for wafer separators often depends on the specific requirements of the semiconductor wafers. Tyvek® is chosen for its anti-static properties, helping to reduce the risk of electrostatic damage to sensitive wafers. Carbon separators, made of conductive PS, while more expensive, offer a higher degree of rigidity, providing added support and stability to the wafers during transport and storage. In wafer packaging, the interleaf diameter of these separators is carefully matched with the size of the wafers, ensuring a snug and secure fit. This precise fit is essential for the protection and safety of the wafers, minimizing movement and potential contact damage during shipping and handling. The selection of the right wafer separator material plays a critical role in maintaining the integrity and quality of wafers throughout the logistics and storage processes.